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Solutions > Embedded Computing> Design-in Services

Design-in Services

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2009/11/5		Powerful New Functions in Windows Embedded CE 6.0 R3 Advantech, the global leading ePlatform service provider, has announced their continued support for the new release of Windows Embedded CE 6.0 R3. There are several powerful functions added into this release, including Microsoft Office & PDF viewers, and Adobe Flash Lite 3.1.0. Release 3 gives power to differentiated devices with advanced technologies that deliver better user experiences—all on a solid platform to efficiently bring devices to market.

2009/11/3		New Fanless ETX Computer Module Drives Multiple Applications (SOM-4461) Advantech, a global leading industrial PC solution and service provider, reveals the latest in its line of ultra low power ETX Computer on Module (COM) products. The SOM-4461 is a 114 mm x 95 mm sized CPU module that is powered by an Intel Atom N270 processor with 945GSE chipset which utilizes advanced power management technology. The Atom N270 offers multiple low power states and hyper threading to optimize power saving and performance. In full operation, SOM-4461 only consumes 10 Watts of power. SOM-4461 is able to drive the most demanding applications with full I/O functionality and integrated graphic engine with multiple display support.

2009/4/2		Advantech's Latest Atom Computer On Module

2009/3/3		Advantech Launches a Series of Intel® Atom™ Computer On Modules-From COM-Express and COM-Micro to ETX 3.0 Advantech, a leading IPC solution and service provider, today released a series of Intel® Atom™-based Computer On Modules (COM) that cover a full range of COM form factors, from COM-Express and COM-Micro to ETX 3.0.

2009/3/3		Advantech Supports New Small "Ultra" Computer On Module Form Factor Standard Advantech, a leading IPC solution and service provider will shortly be announcing its support for the new small "Ultra" Computer on Module (COM) form-factor specification. Advantech will jointly release, along with Kontron, the nanoETXexpress specification version 1.0 with the proposed name prefix of "Ultra". The demand for smaller sized COM modules always exists in the market place, and this demand is getting stronger especially after the release of Intel's new generation low power consumption "Atom" solution.

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